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No. STSE-CC2008A
SPECIFICATIONS FOR NICHIA CHIP TYPE BLUE LED
MODEL : NSCB100AT
NICHIA CORPORATION
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Nichia STSE-CC2008A 1.SPECIFICATIONS (1) Absolute Maximum Ratings Item Forward Current Pulse Forward Current Reverse Voltage Power Dissipation Operating Temperature Storage Temperature Soldering Temperature
Symbol IF IFP VR PD Topr Tstg Tsld
Absolute Maximum Rating 25 80 5 100 -30 ~ + 85 -40 ~ +100 Reflow Soldering : 260C Hand Soldering : 350C
(Ta=25C) Unit mA mA V mW C C for 10sec. for 3sec.
IFP Conditions : Pulse Width < 10msec. and Duty < 1/10 = =
(2) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage VF Reverse Current IR Rank T Iv Luminous Intensity Rank S Iv Rank R Iv
Condition IF=20[mA] VR= 5[V] IF=20[mA] IF=20[mA] IF=20[mA]
Min. 124 88 62
Typ. 3.6 148 104 74
(Ta=25C) Max. Unit 4.0 V 50 A 178 mcd 124 mcd 88 mcd
! Measurement Uncertainty of the Luminous Intensity : 10%
Color Rank x y 0.11 0.04
(IF=20mA,Ta=25C) Rank W 0.11 0.15 0.15 0.10 0.10 0.04
! Measurement Uncertainty of the Color Coordinates : 0.01 ! One delivery will include up to one color rank and three luminous intensity ranks of the products. The quantity-ratio of the ranks is decided by Nichia.
2.TYPICAL INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS
Please refer to figure's page.
3.OUTLINE DIMENSIONS AND MATERIALS
Please refer to figure's page. Material as follows ; Package : Encapsulating Resin : Electrodes : Ceramics Silicone Resin Au Plating
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Nichia STSE-CC2008A
4.PACKAGING
* The LEDs are packed in cardboard boxes after taping. According to the total delivery amount, cardboard boxes will be used to protect the LEDs from mechanical shocks during transportation. Please refer to figure's page. The label on the minimum packing unit bag shows; Part Number, Lot Number, Ranking, Quantity * The boxes are not water resistant and therefore must be kept away from water and moisture.
5.LOT NUMBER
The first six digits number shows lot number. The lot number is composed of the following characters; !"#### - !$ ! - Year ( 1 for 2001, 2 for 2002 ) " - Month ( 1 for Jan., 9 for Sep., A for Oct., #### - Nichia's Product Number ! - Ranking by Color Coordinates $ - Ranking by Luminous Intensity
B for Nov.)
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Nichia STSE-CC2008A
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item Resistance to Soldering Heat (Reflow Soldering) Solderability (Reflow Soldering) Thermal Shock Temperature Cycle Moisture Resistance Cyclic High Temperature Storage Temperature Humidity Storage Low Temperature Storage Steady State Operating Life Steady State Operating Life of High Temperature Steady State Operating Life of High Humidity Heat Steady State Operating Life of Low Temperature Vibration Standard Test Method JEITA ED-4701 300 301 JEITA ED-4701 300 303 JEITA ED-4701 300 307 JEITA ED-4701 100 105 JEITA ED-4701 200 203 JEITA ED-4701 200 201 JEITA ED-4701 100 103 JEITA ED-4701 200 202 Test Conditions Tsld=260C, 10sec. (Pre treatment 30C,70%,168hrs.) Tsld=215 5C, 3sec. (Lead Solder) 0C ~ 100C 15sec. 15sec. -40C ~ 25C ~ 100C ~ 25C 30min. 5min. 30min. 5min. 25C ~ 65C ~ -10C 90%RH 24hrs./1cycle Ta=100C Ta=60C, RH=90% Ta=-40C Ta=25C, IF=20mA Ta=85C, IF=5mA 60C, RH=90%, IF=15mA Ta=-30C, IF=20mA JEITA ED-4701 400 403 JEITA ED-4702 JEITA ED-4702 100 ~ 2000 ~ 100Hz Sweep 4min. 200m/s2 3direction, 4cycles 3mm, 5 1 sec. 5N, 10 1 sec. Note 2 times Number of Damaged 0/50
1 time over 95% 20 cycles 100 cycles 10 cycles 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 500 hrs. 1000 hrs. 48min.
0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50
Substrate Bending Stick
1 time 1 time
0/50 0/50
(2) CRITERIA FOR JUDGING THE DAMAGE Item Symbol Test Conditions Criteria for Judgement Min. Max.
Forward Voltage VF Reverse Current IR Luminous Intensity IV *) U.S.L. : Upper Standard Level
IF=20mA U.S.L.*)# 1.1 VR=5V U.S.L.*)# 2.0 IF=20mA L.S.L.**)# 0.7 **) L.S.L. : Lower Standard Level
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Nichia STSE-CC2008A
7.CAUTIONS
(1) Moisture Proof Package * When moisture is absorbed into the SMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. * The moisture proof package is made of an aluminum moisture proof bag with a zipper. A package of a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag. The silica gel changes its color from blue to pink as it absorbs moisture. (2) Storage * Storage Conditions Before opening the package : The LEDs should be kept at 30C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. * If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : more than 24 hours at 65 5C * Nichia LED electrode sections are comprised of a gold plated. The gold surface may be affected by environments which contain corrosive gases and so on. Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the User use the LEDs as soon as possible. * Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. (3) Heat Generation * Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. * The operating current should be decided after considering the ambient maximum temperature of LEDs.
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Nichia STSE-CC2008A (4) Soldering Conditions * The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a guarantee on the LEDs after they have been assembled using the dip soldering method. * Recommended soldering conditions
Pre-heat Pre-heat time Peak temperature Soldering time 10 sec. Max. Condition refer to Temperature - profile 1. Reflow Soldering Lead Solder Lead-free Solder 180 ~ 200C 120 ~ 150C 120 sec. Max. 120 sec. Max. 240C Max. 260C Max. 10 sec. Max. refer to Temperature - profile 2. Temperature Soldering time Hand Soldering Lead Solder 300C Max. 3 sec. Max. (one time only) Lead-free Solder 350C Max. 3 sec. Max. (one time only)
# After reflow soldering rapid cooling should be avoided. [Temperature-profile (Surface of circuit board)] Use the conditions shown to the under figure.
<1 : Lead Solder>
2.5 ~ 5C / sec. Pre-heating 120 ~ 150C 60sec.Max.
Above 200C
<2 : Lead-free Solder>
240C Max. 10sec. Max. 1 ~ 5C / sec. 1 ~ 5C / sec. Pre-heating 180 ~ 200C 60sec.Max.
Above 220C
260C Max. 10sec. Max.
2.5 ~ 5C / sec.
120sec.Max.
120sec.Max.
[Recommended soldering pad design] Use the following conditions shown in the figure.
2.2 1.5 4.4
(Unit : mm)
* The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicon resin should be used. * Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. * Reflow soldering should not be done more than two times. * When soldering, do not put stress on the LEDs during heating. * After soldering, do not warp the circuit board.
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Nichia STSE-CC2008A (5) Cleaning * It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. * Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. (6) Static Electricity * Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. * All devices, equipment and machinery must be properly grounded. It is recommended that measures be taken against surge voltage to the equipment that mounts the LEDs. * When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended). * Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases, the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria : (VF > 2.0V at IF=0.5mA) (7) Others * Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when using the LEDs with matrix drive. * The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking directly at the LEDs with unaided eyes for more than a few seconds. * The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Nichia's sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices). * User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the User shall inform Nichia directly before disassembling or analysis. * The formal specifications must be exchanged and signed by both parties before large volume purchase begins. * The appearance and specifications of the product may be modified for improvement without notice.
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Nichia
STSE-CC2008A

ICI Chromaticity Diagram
0.9
520
0.8
530 510 540 550 560
0.7
0.6
570 500
0.5
580 590
y
0.4
600 610 620 630
0.3
490
0.2
480
0.1
470 460
0 0 0.1
W
0.2
0.3
0.4
0.5
0.6
0.7
0.8
x
-7-
! Forward Voltage vs. Forward Current
200 Forward Current IFP (mA) 100 50 20 10 5 Ta=25C
! Forward Current vs. Relative Luminosity
3.5 Relative luminosity (a.u.) 3.0 2.5 2.0 1.5 1.0 0.5 0 0 20 40 60 80 100 120 Forward Current IFP (mA) Ta=25C
! Duty Ratio vs. Allowable Forward Current
Allowable Forward Current IFP (mA) 200 Ta=25C 100 80 50 25 20 10 1
1 2.5
3.0 3.5 4.0 4.5 5.0 Forward Voltage VF (V)
5 10 20 50 100 Duty Ratio (%)
! Ambient Temperature vs. Forward Voltage
5.4 Forward Voltage VF (V) 5.0 4.6 4.2 3.8 3.4 3.0 2.6 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (C) IFP=60mA IFP=20mA IFP=5mA
! Ambient Temperature vs. Relative Luminosity
2.0 Relative Luminosity (a.u.) IFP=20mA 1.0
! Ambient Temperature vs. Allowable Forward Current
Allowable Forward Current IF (mA) 40 30 25 20 10 6 0 0 20 40 60 80 100 Ambient Temperature Ta (C)
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0.5
0.2 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (C)
Nichia
Model
NSCB100A

STSE-CC2008A
NICHIA CORPORATION Title TYP.CHARACTERISTICS
No.
011003105322
! Forward Current vs. Chromaticity Coordinate (D)
0.13 0.11 0.09
1mA(473nm) 5mA(472nm) 20mA(470nm) 50mA(468nm) 100mA(467nm)
! Spectrum
Relative Emission Intensity (a.u.)
1.2 1 0.8 0.6 0.4 0.2 0 350 400 450 500 550 600 650 Wavelength (nm) Ta=25C IF=20mA
Ta=25C
y
0.07 0.05
x ! Forward Current vs. Dominant Wavelength
Dominant Wavelength D (nm)
0.03 0.10 0.12 0.14 0.16 0.18 0.20
! Ambient Temperature vs. Dominant Wavelength
Dominant Wavelength D (nm)
! Directivity (NSCB100A)
1
Relative Luminosity (a.u.)
474 473 472 471 470 469 468 467 466 1 5 10 20 50 100 Forward Current IFP (mA) Ta=25C
476 474 472 470 468 466 464 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (C) IFP=20mA
0
10 20
Y
30 40
X
X Y
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50 0.5 Ta=25C IF=20mA X-X Y-Y 0 90 60 30 Radiation Angle 0 0.5 60
70 80 1 90
Nichia
Model
NSCB100A

STSE-CC2008A
NICHIA CORPORATION Title TYP.CHARACTERISTICS
No.
011003105332
2+0.3 - 0.2 1.3
1.2 0.15
1.7 Anode A 1.6
3
2
LED chip Cathode mark
-10-
K 0.5 Cathode
ITEM PACKAGE ENCAPSULATING RESIN ELECTRODES
MATERIALS
Ceramics Silicone Resin Au Plating
Nichia STSE-CC2008A
Model
NSCB100A
Unit mm 10/1 Scale Allow 0.2
NICHIA CORPORATION
Title No.
OUTLINE DIMENSIONS
011004105342
Taping part
1.5+0.1 -0 40.1 20.05 1.750.1 0.20.05
Reel part
180+0 -3 110 Min.105
11.41 90.3
Cathode
3.50.05
80.2
2
3.50.2
1 0.8
0.2
13
40.1 1+0.25 -0 2.5
0.2
2 MAX
Label
XXXX LED
TYPE NSCx100AT LOT XXXXXX-!! QTY pcs
Reel End of tape
No LEDs LEDs mounting part
No LEDs
60+1 -0
-11Pull direction Top cover tape Embossed carrier tape Reel Lead Min.40mm (No LEDs) Reel Lead Min.160mm (No LEDs is more than 40) Reel Lead Min.400mm
Nichia STSE-CC2008A
2,500pcs/Reel
Taping is based on the JIS C 0806 : Packaging of Electronic Components on Continuous Tapes.
Model
NSCx100AT
Unit mm Scale Allow
NICHIA CORPORATION
Title No.
TAPING DIMENSIONS
011004105352
Nichia STSE-CC2008A
The reel and moisture absorbent material are put in the moisture proof foil bag and then heat sealed.
Reel
Label
Seal
NICHIA
XXXX LED
TYPE LOT QTY NSCx100AT xxxxxx-!" PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Moisture absorbent material
Moisture proof foil bag
Empty space in the box is filled with cushion material.
Label
NICHIA
Nichia
LED
TYPE QTY
XXXX LED
NSCx100AT PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Packing unit
Moisture proof foil bag Cardboard box Cardboard box S Cardboard box M Cardboard box L Reel/bag 1reel Quantity/bag (pcs) 2,500 MAX. Reel/box 4reel MAX. 10reel MAX. 16reel MAX. Quantity/box (pcs) 10,000 MAX. 25,000 MAX. 40,000 MAX.
Dimensions (mm) 270!280!100!4t 270!280!200!4t 270!280!300!4t
Model
NSCx100AT
NICHIA CORPORATION
Title No.
PACKING
011004105362
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